Machine features- Small laser welding spot diameter and minimal heat-affected zone, preventing porosity, collapse and metallographic changes, reducing post-weld processing.
- Co-axial microscope observation for focusing and positioning; liquid crystal light valve and full-reflection eye protection.
- Stable operation supporting continuous and intermittent working modes.
- XYZ high-rigidity worktable with high repeatability.
- Capable of repairing cracks, chips and other surface damages on molds.
ApplicationsCommonly used in mold manufacturing for mobile phones, electronic devices, automotive and motorcycle industries. Suitable for repair welding on mold steels, stainless steel, beryllium copper, precious metals and very hard materials up to HRC60.
Technical data sheetModel: MOLD302 (MOLD301 available)
Control mode: Single-chip microcomputer
Manipulation device: Industrial control joystick
XY axes stroke: 100mm × 100mm (step motor drive)
Z axis stroke: 500mm (step motor drive)
Worktable load: <80kg
Observing system: Microscope (CCD monitor optional)
Table size: 600mm × 800mm
Laser wavelength: 1064nm
Max. laser output power: 300W
Max. laser pulse energy: 30J (standard); 60J, 90J (optional)
Min. spot diameter: 0.2mm
Pulse width: ≤50ms
Pulse frequency: ≤200Hz
Cooling mode: Water chiller (integrated 3P chiller)
System power consumption: 16.5kW
Power supply: 220V/50Hz 3kW
Characteristics / technical specifications- Model: MOLD302
- Control mode: Single-chip microcomputer
- Manipulation device: Industrial control joystick
- XY axes stroke: 100mm × 100mm (step motor drive)
- Z axis stroke: 500mm (step motor drive)
- Worktable load: <80kg
- Observing system: Microscope (CCD monitor optional)
- Table size: 600mm × 800mm
- Laser wavelength: 1064nm
- Max. laser output power: 300W
- Max. laser pulse energy: 30J; 60J, 90J (optional)
- Min. spot diameter: 0.2mm
- Pulse width: ≤50ms
- Pulse frequency: ≤200Hz
- Cooling mode: Water chiller (integrated 3P chiller)
- System power consumption: 16.5kW
- Power supply: 220V/50Hz 3kW