Pulsed laser source HLD

gasinfraredfor micro-machining

Machine Features

• High laser power with an integrated external beam‑shaping optical system for controlled beam profile.
• Generates quasi‑fundamental Gaussian beams with a minimal focused waist diameter, producing ultra‑fine, well‑defined machining traces and narrow heat‑affected zones.
• Suitable for microvia drilling on rigid and flexible PCBs, precision plastic cutting, ceramic scribing and drilling, glass cutting and cladding, backlight panel processing, precision metal cutting and cladding, and marking/engraving/cutting of leather and other non‑metallic materials.

Applications
Surface treatment and precision machining of mobile phone housings; microvia processing for printed circuit boards and flexible PCBs; precision plastic cutting; glass cutting and cladding; marking and processing of non‑metallic materials such as leather; automotive spare part processing; precision cutting of industrial logos and brand marks.

Technical specifications

• Commercial designation (model): HLD Series
• Product type: CO₂ Laser
• Beam characteristics: quasi‑fundamental Gaussian beams, minimal focused waist diameter
• Optical system: integrated external beam‑shaping optical system
• Main strengths: high laser power, controlled beam profile, ultra‑fine machining capability, narrow heat‑affected zone
• Typical applications: PCB microvia machining, flexible PCB processing, precision plastic cutting, ceramic scribing & drilling, glass cutting/cladding, backlight panel processing, precision metal cutting & cladding, marking/engraving/scribing/cutting of leather and other non‑metallic materials