UV laser marking system EP-15-THG-F

automaticfor pipesfor electronic components

Product overview

• Split-type modular UV laser marking system designed for integration into assembly lines or for installation on lifting/handling devices.
• Intended for inline processing and high-throughput production marking.
• Compatible with UV, green and IR laser sources in modular configurations.
• Capable of micro-hole drilling with diameter ≤ 10 µm.

Applications

• Marking of logos, model numbers, origin and traceability codes on electronic components and assemblies.
• Marking on packaging materials: food packaging, PVC pipes, HDPE/PO/PP pharmaceutical packaging.
• PCB marking and cutting; wafer micro-drilling and blind-hole machining.
• Coating removal on metal and non-metal substrates; marking of low-voltage equipment and fire-resistant materials.

Technical data sheet
Machine model: EP-15/25/30-THG-F
Laser wavelength: 355 nm
Laser power options: 4 W / 7 W / 10 W / 15 W / 25 W
Minimum marking line width: 10–15 µm
Marking speed: up to 250 characters/sec
Marking area: 100 × 100 mm (standard F160 lens)
Pulse repetition frequency: 10–200 kHz
Cooling: water-cooled
Power supply: AC 220 V, 50 Hz, 16 A
Total power consumption: ≤ 1.5 kW
Overall dimensions (W×D×H): 600 × 800 × 1350 mm


Characteristics / Technical specifications

• Model family: EP-15/25/30-THG-F (modular split-type marking system).
• Ultraviolet laser wavelength: 355 nm.
• Available average power: 4 W, 7 W, 10 W, 15 W, 25 W.
• Minimum marking line width: 10–15 µm.
• High marking speed up to 250 characters/sec.
• Standard marking area: 100 × 100 mm (F160 lens).
• Pulse repetition frequency range: 10–200 kHz.
• Water-cooled system for stable operation.
• Electrical requirements: AC 220 V, 50 Hz, 16 A; total consumption ≤ 1.5 kW.
• Compact footprint: 600 × 800 × 1350 mm (W×D×H).