Key features- Good beam quality and small spot size for ultra-fine marking
- Minimal heat-affected zone to avoid damage to processed materials
- High marking speed with precision and stable long-term operation
- No consumables; low operating and maintenance costs
- Suitable for continuous industrial use
Applications- Cutting and drilling brittle materials such as glass, sapphire and ceramics
- LCD and OLED panel cutting (C, R, U angle cutting)
- Ultra-precise glass marking for invisible micro QR codes (0.2 mm) and other fine marks
- Traceable marking on metal medical devices (etching/anti-oxidation marking)
- Cutting, drilling or coating removal on plastics, oxides and organics
Technical dataMachine model: EP-IRPS-20
Laser wavelength: 1064 nm
Pulse duration: 10 ps
Laser power: 20 W
Repetition frequency: 1000 kHz
Marking area: 100×100 mm
Marking line width: ≤0.03 mm
Marking depth: ≤0.1 mm
Minimum character size: 0.06 mm
Marking speed: ≤7000 mm/s
Repeatability: ±0.01 mm
Power supply: AC 220 V, 50 Hz, 16 A
Total power consumption: ≤1.5 kW
Characteristics / Technical specifications- Machine model: EP-IRPS-20
- Laser wavelength: 1064 nm
- Pulse duration: 10 ps
- Laser power: 20 W
- Repetition frequency: 1000 kHz
- Marking area: 100 × 100 mm
- Marking line width: ≤0.03 mm
- Marking depth: ≤0.1 mm
- Minimum character size: 0.06 mm
- Marking speed: ≤7000 mm/s
- Repeatability: ±0.01 mm
- Power supply: AC 220 V, 50 Hz, 16 A
- Total power consumption: ≤1.5 kW