Laser marking and engraving machine HDZ-WAF600

for waferstraceabilityhigh-accuracy

Product overview

• Fully-automatic wafer laser marking machine engineered for wafer-level identification and traceability.
• Laser options: UV or green laser with fine focusing spot for non-contact marking.
• Fully-automatic loading and unloading, automatic edge searching and automatic fault alarm.
• Computer control (Windows platform) with English interface and self-developed software for process management.
• Water-cooled system; final processing repeated positioning precision ±0.05 mm; precise marking to the die.

Applications
Applicable to 6-inch, 8-inch and 12-inch wafers for semiconductor wafer identification, traceability, coding and process marking.

Marking effects

• Wafer-level marking
• Dot-matrix character marking

Technical data
Model | HDZ-WAF600
Laser type (optional) | UV / green
Typical laser power | UV 7W; green 10W (customizable)
Cooling mode | Water cooling
Final processing repeated positioning precision | ±0.05 mm
Processing product type | 6, 8, 12 inch wafers
Power supply | 220V, 50Hz
Overall dimension (reference) | 1950 mm × 1650 mm × 1635 mm


Features / Technical specifications

• Model: HDZ-WAF600
• Automation: Fully-automatic loading/unloading; automatic edge searching; automatic fault alarm
• Control & software: Computer control system, Windows platform, English interface, self-developed software
• Marking: Non-contact, precise die-level marking; suitable for wafer-level and dot-matrix marking
• Positioning precision: ±0.05 mm (final processing repeated)
• Cooling: Water cooling
• Supported wafer sizes: 6", 8", 12"
• Power supply: 220V, 50Hz