Board-to-board connector ER8 Series
databackplaneFPC/FFC

Board-to-board connector - ER8 Series - Hirose Electric Europe B.V. - data / backplane / FPC/FFC
Board-to-board connector - ER8 Series - Hirose Electric Europe B.V. - data / backplane / FPC/FFC
Board-to-board connector - ER8 Series - Hirose Electric Europe B.V. - data / backplane / FPC/FFC - image - 2
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Characteristics

Type
data
Format
backplane, FPC/FFC, SMT, board-to-board
Shape
straight, parallel, right-angle
Electrical characteristics
high-speed
Material
gold
Product applications
transmission, guide, stacking
Domain
for industrial applications, for medical applications, for automation applications
Other characteristics
large
Pitch

0.8 mm
(0.031 in)

Data rate

10 b/s

Operating temperature

Max.: 125 °C
(257 °F)

Min.: -55 °C
(-67 °F)

Description

[FunctionMAX PCIe Gen.4 High Speed Transmission (16+Gbps), 0.8mm Pitch, Board-to-Board Connectors PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors 1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.

Catalogs

Exhibitions

Meet this supplier at the following exhibition(s):

IZB
IZB

27-29 Oct 2026 Wolfsburg (Germany) Hall Hall 3 - Stand 3415

  • More information
    electronica 2026
    electronica 2026

    10-13 Nov 2026 Munich (Germany) Hall Hall B3 - Stand 115

  • More information
    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.