Thermal interface material 1150 series

Thermal interface material (TIM) 1150 series Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling Thermal interface material is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor. The material is easy to handle and is not messy. It is available in solid and liquid form and in various thicknesses. Thermal conductivity The thermal conductivity of the interface material has a significant impact on its thermal performance. The high thermal conductivity guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation. Properties Good insulation properties Heat-conducting Good compressibility Flexible Environmentally friendly Benefits Smooth surface Very good thermal transfer properties even at very low contact pressure Low hardness High self-adhesion UL listed Thickness 0.01 to 8 mm This film is especially suitable for high-power applications. It has excellent thermal and electrical properties. Thanks to its good performance, the material can be used reliably in densely packed electronic applications.