Base Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance control
materials: M7NE
Board thickness: 8.0+/-0.8mm
Finishing Size: 870x500mm
Min Line w/s: 5/5mil
Min drill size [FHS/DHS] : 0.34mm/0.45mm
Plating AR DHS : 18:1
Surface finish: ENIG
Structure: 1+N+2+N+1
Other : Press fit blind via hole
Impedance Tol: +/-8%
Press fit hole location Tol: +/- 1mil (At one connecter)