For embedded and high temperature applications
Polyimide coated enabling survival at temperatures up to 300°C
Ultra-low and low profile, bend insensitive fiber for downhole Seismic geophone sensors and high temperature distributed pressure and temperature sensors
Enhanced photosensitivity
Maintains composite material strength when embedded
Typical Applications:
Downhole sensors
Geophones
DTS, DAS, DSS and DPS
Embedded sensors
FBGs
Biomedical in vivo sensors
High temperature sensors