Reflow soldering oven
vacuum

reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
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Characteristics

Technique
reflow
Operating mode
vacuum

Description

Programmable vacuum reflow soldering and brazing oven with heating area 420x420mm. Infrared lamps are placed crossed under the tooling plate and in the lid. Tooling plate in a square form with dimensions 420x420mm can be produced of any suitable material also with custom openings for fixtures inside it. Design enables loading of tooling plate inside the chamber together with the parts on it - suitable for serial production. Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate. Process environment - nitrogen, inert gas, formic acid, forming gas Maximum temperature - 450°C Heating area - 420 x 420 mm Heating plate - removable: graphite, aluminum, etc. Clearance above heating plate - 60 mm Heat up / cool down ramp - 250°C/min Control deviation - +/- 0.5°C Heating elements - 16x infrared heating lamps in two crossed rows Heating control - individual/adjustable on every heating lamp Cooling of heating plate - nitrogen flow Temperature measurement - up to 4x thermocouples K-Type freely positional Pressure measurement - full range over two gauges Maximum vacuum - 1x10-2 mbar (5x10-6 mbar with turbo pump) Formic acid bubbler - 40 ml container in front panel with auto refill Cooling of chamber body - water/ethylene glycol mixture Lid viewing port - 80 mm with shutter Display - 7" LCD with touch screen PC Software - process logging, recipe transfer, etc. User interface - remote control over relay I/Os Dimensions - see layout Weight - 280 kg Power supply - 3 phase, country specific

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