metal cutting machine / laser / wafer / CNC
IX-210

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Characteristics

  • Material:

    for metal

  • Technology:

    laser

  • Product handled:

    wafer

  • Control type:

    CNC

  • Other characteristics:

    automatic, programmable

Description

IPG Microsystems’ IX-210 solid-state laser machining system delivers high-speed wafer singulation with operating costs 20-30 times less than dicing saws or diamond scribes. With its high throughput and process automation, the system pays for itself in weeks rather than years. The revolutionary IX-210 employs proprietary technology including lasers, optics, motion control and process automation, providing unparalleled performance; with multiple laser choices the system can be configured to process a multitude of materials.