Laser marking system

automaticfor wafersglass

Product overview
The Fully Automatic High-Precision Laser Marking Equipment from JPT is engineered for automated, high-accuracy marking on glass, resin and semiconductor wafers. The system integrates JPT's ultraviolet picosecond laser source, galvanometer scanning and precision optics to deliver fine, repeatable marks with minimal thermal impact.

Key advantages

• Wide wafer compatibility: supports 4", 6", 8" and 12" wafers (customizable) to cover multiple process stages.
• Dual-side automatic processing: automatic recognition and marking on both front and back surfaces to streamline workflows.
• Automated material handling: LoadPort/SMIF modules, edge finders and robotic wafer handlers enable continuous, low-intervention operation.
• Ultrafast ultraviolet picosecond marking: produces clear marks with minimal heat-affected zone, preserving wafer integrity and yield.
• Modular and scalable design: machine modules support functional expansion and integration into production lines.

Technical specifications

• Laser source: Ultraviolet picosecond
• Laser power: 5W / 10W
• Cooling: constant temperature water cooling
• Beam quality: M2 < 1.3
• Focusing: galvanometer scanning
• Focal spot size: < 10 μm
• Maximum processing speed: 1000 mm/s
• Processing accuracy: ±20 μm
• Positioning accuracy: ±5 μm
• Maximum workpiece sizes supported: 4", 6", 8", 12" (customizable)
• Throughput (UPH): 35–50 pcs/hour
• Equipment dimensions (L×W×H): 1710 × 2200 × 2200 mm
• Control software: JPT

Applications & industries

• Semiconductor and wafer fabrication (3C electronics)
• Glass and resin component marking
• High-mix, automated production lines requiring traceability

Automation & integration

• Interfaces for LoadPort/SMIF and factory automation
• Edge-finding and automatic alignment for reliable positioning
• Modular layout for inline or standalone deployment