Optical inspection machine CIRCL™

for wafersfor the electronics industrymacro defect

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System The CIRCL™ cluster tool has four modules, covering all wafer surfaces and providing parallel data collection at high throughput for efficient process control. The modules comprising the latest-generation CIRCL5 system include: front side wafer defect inspection; wafer edge defect inspection, profile, metrology and review; backside wafer defect inspection and review; and, optical review and classification of front side defects. Data collection is controlled by DirectedSampling™, an innovative approach that uses results from one measurement to trigger other types of measurements within the cluster. The modular configuration of CIRCL5 offers flexibility for varying process control needs, saves overall fab space, reduces wafer queue time, and provides a cost-effective upgrade path to protect a fab's capital investment. Applications Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor