Temperature monitoring system Process Probe™ 1730

for process control

In Situ Wafer Temperature Monitoring System The Process Probe™ 1730 instrumented wafers enable precise in situ characterization of wafer temperature profiles in photoresist track systems, temperature controlled wafer chuck systems, oven applications, and resist bake, polyimide, and SOG applications. The Process Probe 1730 helps engineers characterize and fine tune process conditions to improve process equipment performance for higher yield. Applications Process development, Process qualification, Process tool qualification, Process tool matching Lithography track systems, Temperature controlled wafer chuck systems and ovens | -150-300°C