Optical inspection system Teron™ SL6xx series

surface defectfor wafers

Reticle Defect Inspection Systems for IC Fab Applications The Teron™ SL655 is used to assess incoming reticle quality and to re-qualify reticles during production use and after reticle cleaning, helping chipmakers protect yield by reducing the risk of printing defective wafers. With STARlightGold™ technology, the Teron SL655 produces the sensitivity required to monitor reticle degradation and detect yield-critical reticle defects, such as haze growth or contamination, on a full range of mask types (ILT, CPL, EUV, etc.) at the 10nm design node and beyond. The Teron SL655 also has industry-leading production throughput, supporting the fast cycle times needed to qualify the increased number of reticles associated with advanced IC design nodes. Applications Teron™ SL670e: Inspection of EUV and optical (optional) reticles during chip manufacturing for 7nm/5nm design node IC technologies. Teron™ SL655: Inspection of optical and EUV (optional) reticles during chip manufacturing for 10nm design node IC technologies. Teron™ SL650: Inspection of optical reticles during chip manufacturing for 20nm design node IC technologies. X5.3™: Inspection of non-critical reticles during chip manufacturing for ≥20nm design node IC technologies. RA (Reticle Analyzer): Reticle data analytics system for IC fabs supports applications such as automatic defect classification, lithography plane review and defect progression monitoring.