COM Express computer-on-module COMe-bID7

Intel® Xeon D-1735TRIntel® Xeon D-1746TERIntel® Xeon-D-1712TR

The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions. The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available. 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures. The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.