Automatic packaging machine APAMA C2S
line-typetabletfor laboratories

automatic packaging machine
automatic packaging machine
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Characteristics

Operational mode
automatic
Type
line-type
Applications
tablet
Domain
for laboratories
Other characteristics
multipack

Description

The APAMA Chip-to-Substrate (C2S) offers fully Automated solution for Thermo- Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC). Cost-of-Ownership Advantage Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers. C2S Features & Benefits: Automation Control Placement Accuracy Performance Yield Enhancement Adaptability Cost-of-Ownership Advantage Enterprise & Consumer Applications Network Routers and Switches Servers High-end PCs and Graphics Smartphones and Tablets
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.