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Hot dip galvanizing
for electronicsmedium seriessmall series

hot dip galvanizing
hot dip galvanizing
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Characteristics

Process
hot dip
Applications
for electronics
Production method
medium series, small series, prototyping
Certifications
ISO 9001, ISO 14001

Description

Technological process Chemical degreasing Two-step flow rinse Pickling I Pickling II Two-step flow rinse Electrochemical degreasing One-step flow rinse Decapping Two-step flow rinse Galvanizing or electroplating Zn/Ni Three-step flow rinse Clearing up PASSIVATION (blue Cr3+, thick Cr3+ and yellow Cr6+) or Transparent passivation for Zn/Ni Two-step flow rinse SEALING Drying
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.