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DCB substrate
for power electronics

DCB substrate
DCB substrate
DCB substrate
DCB substrate
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DCB, for power electronics

Description

Features: 0.25-1mm thick ceramic with 0,3mm copper bonded on both sides with Optional Nickel plating DCB thermal expansion matches silicon Optimized for use in power hybrids Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance Good Thermal Conductivity Very Good Thermal Cycling Capability Good Heat Spreading, leaving no hot spots Can be Structured like PCB or IMS Substrate Basis for Chip-on-board technology

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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