1. Products
  2. Hot bonder
  3. Logitech Limited

Hot bonder C series

hot bonder
hot bonder
hot bonder
hot bonder
Add to favorites
Compare this product
 

Description

Logitech’s CB30/CH30 Bonding Unit & Hotplate complement the Compact 50 Thin Section Preparation System (lapping machine and jig). As part of this system the CB30/CH30 Bonding Unit & Hotplate are ideal for use in research or education, wherever a precise thin section is required. Typical materials include rocks, concrete, fossils, bone and many other forms of geological, archaelogical, petrological and mineralogical samples. CB30 Bonding Unit The CB30 is an easy to use clamping device designed for effective bonding between sample and support slide. It accepts two standard glass slides of 28x48mm, 26x46mm or 26x76mm at a time. CH30 Hotplate The CH30 is a portable unit, which by heating the surface of the CB30 bonding unit ensures samples are quickly cured. The hotplate allows the operator to use different temperature zones. When very high temperatures are required, the central section of the hotplate emanates a maximum temperature of 450°C. This ensures samples are quickly and evenly cured. The reduced temperature outwith the central section provides an ideal means for warming glass slides and samples. Key Features Holds 2 of 28x48mm, 26x46mm or 26x76mm Effective bonding in a compact unit Varying temperature zones for maximum sample compatibility User friendly

Catalogs

No catalogs are available for this product.

See all of Logitech Limited‘s catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.