UV laser cutting machine MicroLine 2000 Ci

for plasticsfor PCBcompact

Compact, high-output and inline-capable. The technology driving the MicroLine 2000 Ci is based on the proven MicroLine 1000 series. It follows the same new modern machine layout as the first system and also has a few things to offer under the hood. Process advantages due to laser technology Compared to conventional tools, laser processing offers a compelling series of advantages. The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths. There is no need to factor in retooling times during a change of production. In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur. The ablation products are extracted by suction directly at the cutting channel. Even sensitive substrates can thus be precisely processed. The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel. The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.