SMT Stencil Printers
LPKF ProtoPrint S and ProtoPrint S RP
• SMD fine-pitch printing down to 0.3 mm
• Screen printing, gluing, test film printing
• Printing of populated double-sided boards
• Parallel separation of stencil and board
Reliable Solder Paste Printing
When mounting tiny SMD components on boards, the developer needs to be able to rely on
precisely applied solder paste. A large number of solder deposits can be achieved reliably and
rapidly with stencil printing.
With the ProtoPrint S, LPKF offers a precise manual stencil printer for SMT prototypes and small batches.
The ProtoPrint S uses stainless steel stencils, whereas the ProtoPrint S RP has an integrated ZelFlex clamping frame to allow the additional use of polyimide film. Polyimide film stencils can be manufactured easily with any LPKF ProtoMat.
The LPKF stencil printers offer high positioning accuracy, SMD fine-pitch printing, adjustable printing height, speed-controlled parallel separation of stencil and board, and easy tensioning of the stencil frames. Before PCB production a print can be made on a test film – for easily checking the print result and finetuning with micrometer screw gauges.