Reflow soldering machine ProtoFlow E
semi-automaticfor PCB

reflow soldering machine
reflow soldering machine
reflow soldering machine
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Operating mode
for PCB

Max.: 1,650 W

Min.: 0 W


Economical Convection Oven for SMT Prototyping LPKF ProtoFlow E Fully convectional Lead-free reflow process Temperature up to 320°C Multi-zone temperature/time profiles USB connectivity Economical Solution for SMT Prototyping To provide a reliable connection between SMD components and the PCB circuitry, soldering by solder paste deposits is the common technology. The LPKF ProtoFlow E is a very economical and easy-to-use solution for reflow soldering PCBs. Its temperature limit isn’t reached until 320 °C (608 °F). The reflow oven with a max. material size of 160 mm x 200 mm (6.3” x 8”) is perfectly matched to the LPKF ProtoPrint E. A drawer window offers a view of the lighted process chamber, and the USB connection allows the LPKF ProtoFlow E to also be programmed from a PC for faster and easier process analysis. LPKF ProtoFlow E Max. PCB size 160 mm x 200 mm (6.3” x 8”) Max. preheat temperature/time 220 °C (428 °F), 999 s Max. reflow temperature/time 320 °C (608 °F), 600 s Long thermal treatment: temperature/time 220 °C (428 °F), 64 h Temperature stabilizing time <5 min Power supply Single-phase 220–240 V, 50–60 Hz, 1650 W (max.) Dimensions (W x H x D) 400 mm x 280 mm x 380 mm (15.7” x 11” x 14.7”) Weight 18 kg (40 lbs)
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.