SMT / Finishing
Assembly of PCB prototypes and low volumes
From application of the solder paste to placement of individual components, low-cost and proven processes lead to an electrically functional product in just a few steps.
SMT technology for developers
In series production, surface mount devices (SMDs) are assembled with SMT pick and place machines. Before this process takes place, paste is printed onto the pads on the board. After the SMDs have been placed on the printed circuit board, reflow soldering is performed. All processes and methods used in SMT production – adapted to the requirements of the electronics laboratory – are also available for in-house PCB prototyping.
SMT methods for PCB prototyping
The prototyping process isn’t finished after the circuit board has been manufactured.With the subsequent processes – solder mask coating, solder paste printing, assembly, and reflow soldering – a circuit board becomes an electronic assembly.
Application of solder paste on all pads on which components should be placed requires maximum precision. The LPKF ProtoPrint S stencil printer, a manual stencil printer for SMT prototyping and low-volume production, performs this task.
The mechanical resolution down to a grid size of 0.3 mm (12 mil) allows stencil printing in the ultrafine pitch range. The stencil thickness (between 100 µm and 250 µm) determines the amount of solder paste to be applied.
For PCB prototyping, milling of polyimide stencils with LPKF circuit board plotters is a genuine alternative to laser-cut steel stencils, especially from a cost perspective. Solder paste stencils (SMT stencils) can usually be milled in-house in less than ten minutes.