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Soldering hot plate QK853ESD
cooling

Soldering hot plate - QK853ESD - Madell Technology - cooling
Soldering hot plate - QK853ESD - Madell Technology - cooling
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Characteristics

Applications
soldering
Other characteristics
cooling

Description

Fast heat up, 10 seconds to reach 250°C. l Built in temperature sensor for stable temperature control. l Hot and cool air selection for chip preheating or cooling. l Used together with a hot air rework station and fixture for BGA and other IC's. l Power: 460W. l Temperature: 120°C to 250°C(at nozzle). l Air volume: 0.18 cubic meter/min. l Size: 100(W) x60 (H) x170 (D) mm. l Weight: 1kg.

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Rework Stations

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