Epoxy adhesive EP21TDCS

two-componentelectrically-conductiveindustrial

The Master Bond Polymer System EP21TDCS is a dual component, silver packed adhesive that is electrically condusive. It serves a sealant fluid for superior bonding and sealing developed to cure at room temperature or faster at high temperatures. This product has a 1:1 mix ratio either by weight or volum. It produces a high bonding strength that reaches more thatn 850 psi tensile shear. When measured and cure at 75°F, it develps a T-peel of greater than 10 pli. Containing zero diluents or solvents, it is completely reactive and cured system volume resistance is lower that 10-3 ohm-cm. It can be utilized with reduced sagging or driping even on vertical surfaces.