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Epoxy adhesive EP3HTS-TC
for metalfor plasticsfor ceramics

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, for ceramics, for composite materials
Number of components
single-component
Technical characteristics
low outgassing, fast curing, thermally-conductive, electrically-conductive
Applications
sealing, for coating, for bonding
Working temperature

Max.: 400 °F
(204.44 °C)

Min.: -80 °F
(-62.22 °C)

Description

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material. It is serviceable from -80°F to +400°F (-60°C to +200°C).

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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