Sintering furnace

chamberannealingbrazing

Our two-station sintering furnace is based on our bottom loading sintering furnace, but is capable of simultaneously processing two loads, essentially doubling throughput within the same footprint. Our sintering furnaces are widely found in the electronics industry for sintering or heat treating electronic components at high temperatures. Cycles consist of atmosphere preparation, heating, rapid cooling and controlled oxidation. The two-station furnace handles two loads simultaneously by heating one load in the hot chamber while cooling the second one in the bottom chamber. This furnace has a usable zone of 12” diameter x 22” high (305 mm x 559 mm), and is suited for large batch processing. The furnace features two chambers, a bottom chamber for loading and unloading, cooling and controlled oxidation, and the top chamber for sintering. Both chambers’ atmospheres are isolated. An electric lift moves the load stacks from the bottom chamber into the heating chamber. The hot zone is capable of temperatures up to 2100°C with Tantalum or Tungsten hot zones.. A high throughput 10″ or 16″ diffusion pumping system handles load outgassing typically seen during product heat-up. An intuitive customized HMI interface runs completely automated cycles start to finish. General specifications: Two load furnace for double capacity of our single-station Hot zone Size 12” diameter x 22” high (305 mm x 559 mm) Tantalum or tungsten heating zone (other materials available) +/- 10°C temperature gradient across usable zone Bottom chamber for loading and cooling, top chamber for sintering. Controlled oxidation at end of cycle High-capacity diffusion pumping system 10″ or 16″