Keep up with Cat.1 Trend: MeiG Smart Launches Several New Cat.1 Modules
In 2020, “Cat.1” suddenly appeared and trended in the Internet of Things industry. With the accelerated withdrawal of 2G/3G, Cat.1 filled the market demand of low-and medium-speed Internet of Things users. Therefore, a lot of operators and chipset R&D and manufacturing enterprises work collectively to support the development of Cat.1.
In March last year, MeiG Smart, as the world's leading supplier of cellular modules and IoT solutions, joined hands with UNISOC, the industry's leading manufacturer of cellular chips, to launch the new LTE Cat.1 series module, —SLM320, which has won several operator projects and awards from its partners since its release.
Recently, MeiG Smart has cooperated with UNISOC again and released several Cat.1 modules (SLM322, SLM326, SLM328, SLM330), which are equipped with UNISOC LTE Cat.1 bis IoT chip platform-8910DM, ultra-compact LCC and LGA package design. With smaller package and more innovative design, it is convenient for customers to carry out hardware design, production and processing, improve development efficiency, and provide a higher cost performance experience.
SLM322, SLM326, SLM328 and SLM330 are the new generation LTE Cat.1 modules launched by MeiG Smart. They support 10Mbps DL rate and 5 Mbps UL rate; adopt smaller packaging to meet customers’ design: 22.9x23.9x2.4mm(SLM322 LCC package), 27.6x25.4x2.2mm(SLM326 LCC package), 19.6x21.8x2.4mm(SLM328 LGA package) and 29.0x25.0x2.4mm(SLM330 LCC package); rich network protocols (TCP, UDP, MQTT, FTP/FTPS, HTTP/HTTPS, LWM2M, Coap),