Wire cutting machine SX7720

diamond wireabrasive wirediamond

Overview
The SX7720 is a reciprocating CNC diamond wire cutting machine designed for compact applications in jewelry, materials science, and fine craftwork. This model from the SX77 Series is intended for semi- and non-conductive materials such as jade, quartz, ceramics, and crystals, providing low material loss and high-precision slicing.

Series
SX77 Series

Product Details

• Worktable size: 270×420 mm
• Max. table load: 100 kg
• Max. workpiece thickness: 200 mm

Key Features

• High-precision CNC wire cutting with low vibration
• Supports non-conductive and brittle materials
• Optional taper head configuration for angled cutting
• Compact frame suitable for laboratory and workshop environments
• Efficient coolant system reduces wear and ensures fine surface finishes
• Adjustable cutting tension and feed rate for delicate operations

Recommended Configurations

• Taper Cutting Head: Enables precise angled cuts for complex parts, improving shaping and finishing accuracy
• Coolant Filtration Unit: Keeps cutting fluid clean and extends wire life for consistent performance
• Diamond Wire Tensioner: Automatically maintains stable cutting tension to prevent wire breakage
• Touchscreen CNC Panel: Intuitive interface for programming and job control
• Anti-Vibration Work Table: Increases stability during micro-cutting to reduce vibration and improve precision

Application Case

• Client: Precision Jade Workshop – Thailand
• Use Case: Intricate profile cutting for high-value jade bangles
• Setup: SX7720 with taper function and enclosed coolant circulation
• Results: Cutting thickness tolerance ≤ ±0.02 mm; material loss per cut reduced by ~40%; feedback: precise, smooth cuts with minimal waste

Working Principle
A diamond-coated abrasive wire moves reciprocally through the workpiece under controlled tension, achieving material removal by micro-grinding action. This method is ideal for high-precision, low-damage cutting of hard, brittle, or non-conductive materials.

Performance & Accuracy

• Typical cutting accuracy: within ±0.01–0.02 mm (depending on material and parameters)
• Achievable surface roughness: Ra 0.4–0.8 μm (depending on material and cutting parameters)

Technical specifications

• Worktable size: 270×420 mm
• Maximum table load: 100 kg
• Maximum workpiece thickness: 200 mm
• Recommended materials: jade, quartz, ceramics, crystals, sapphire, silicon wafers, silicon carbide, magnetic materials, rare metals
• Cutting method: reciprocating abrasive/diamond wire micro-grinding
• Cutting accuracy: typically ±0.01–0.02 mm
• Surface finish capability: Ra 0.4–0.8 μm (material-dependent)
• Optional taper head for angled cutting
• Optional coolant filtration unit and enclosed coolant circulation
• Optional diamond wire tensioner and adjustable tension control
• Optional touchscreen CNC control panel
• Anti-vibration work table option for micro-cutting stability