- Production Machines
- Cutting Machine
- Cutting machine for the food industry
- MORCOS Egyptian Engineering Company
Cutting system for the food industry automatic
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Characteristics
- Applications
- for the food industry
- Other characteristics
- automatic
Description
WAFER BOOK CUTTERS
Specifications
Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size
Up to 28 cuts/min are possible
Fully automatic operation
Cutting of single or of several stacked wafer books possible
Different product sizes possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)
Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes
Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production
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WAFER PRODUCTION LINES
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.