Surface mounted enclosure IP66 | MBA series

modularaluminumelectronic equipment

MBA-Enclosures are universal, sturdy and easy to adapt "packaging" of electrical, electronic and pneumatic components. Manufacturing takes place using the die casting or gravity die casting method. MBA-Enclosures can be mechanically processed in a number of ways and there are almost no limits to customised surface design. As terminal enclosures they can be assembled according to a module system with various clamps and cable glands. In measurement and control technology they are often used for encapsulating sensors. Additionally they serve as junction enclosures for cables and lines or take on the job of protecting highly sensitive electronics against water, dirt and dust.