High-end machine that can handle a wide range of panels, from smartphone to PC, vehicle displays and Φ300 mm wafers
Equipped with 3 tool spindles: 1 For O.D. / Φ90mm, 8000 revolutions, 2 for drilling / Φ5mm, 60,000min-1
High productivity. Ideal for complex shapes
Max. 370 mm×260mm~Min 90mm×45mm
Independent drive with 2 machining stages.
Supports also substrate curved panels
Position detection of the material with CCD image processing.
Drilling spindle with 5-station ATC (op.) *ATC specification 50,000min-1
Grinding wheel with long spindle life and easy maintenance
Free curve machining using CAD/CAM