Thickness measuring system NEXIV VMZ-K6555
geometrydiameterposition

thickness measuring system
thickness measuring system
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Characteristics

Measured physical value
thickness, geometry, diameter, position, orientation, angle, distance, shape, coordinate, gap, alignment, flatness, roughness, level, contour
Technology
optical, laser, 3D, video, visual, confocal
Measured material
for tubes, for profiles, parts, for PCB, strip, wire, for inside diameter measurements, for unpatterned wafers, bearing, glass, foil, solids, for film, for wafers, integrated circuit, tool
Applications
control, for industrial applications, laboratory, for production lines, for component testing, for railway applications, for electronics, for the cosmetics industry, for lithium ion batteries, for specular surface, for tape production lines, calibration
Other characteristics
non-contact, automatic, dimensional, high-precision, ophthalmic, CNC, high-speed, stand-alone, vertical, robust, angular, geometric, non-destructive, with wide field-of-view, profilometer, ultra-high accuracy

Description

The Nikon Confocal NEXIV VMZ-K6555 was developed on the strength of Nikon's leading opto-mechatronics (optical, mechanical and electronic) technologies. It incorporates a variety of confocal optics for fast and accurate evaluation of fine three-dimensional surface metrology, image processing technology, and TT L laser autofocus. It allows both 2D and height measurements in the same field of view. The Confocal NEXIV VMZ-K6555 is used for the inspection and measurement of critical dimensions of highly complex structures on advanced semiconductor devices, probe cards, substrate patterns on circuit boards, MEMS and a variety of other demanding applications. Key benefits Simultaneous wide-area height measurement with Nikon proprietary confocal optics 2D measurement with 15x brightfield zoom optics Fully compatible with 300 mm wafer measurement at semiconductor fabs Handles printed circuit board sizes with its 650 x 550mm stroke

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