semi-automatic rework station / for BGA



  • Operational mode:


  • Applications:

    for BGA


Design and functionality come together in the compact and powerful APR-5000-DZ Advanced Package Rework System. This system provides closed-loop control, optimized vision and precise component placement on a compact platform of 19" x 30" (483mm x 762mm). Self contained pumps are standard on this compact platform allowing for easy benchtop setup.

Capable of handling boards up to 15" x 7.75" (381mm x 197mm) with standard fixtures (larger PCB Holder options exist if required) with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000-DZ is ideal for reworking smaller assemblies such as cell phones and laptop computers.

The APR-5000-DZ System incorporates powerful, efficient and fast response convective top reflow heater and bottom dual zone preheaters for delivering fast ramp and tight delta temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked components.