semi-automatic rework station / for BGA
5100 W | APR-5000-XLS-ML



  • Operational mode:


  • Applications:

    for BGA


System provides board capability with small board precision. This system performs precise, cost effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.5mm x 0.25mm).

The flexible APR-5000-XLS System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.

Motorized X,Y,Z adjustments speed placement and help ensure process repeatability. In addition, motorized Theta axis provides 360º rotation to simplify component orientation. Together, these advanced controls reduce operator fatigue, improve placement accuracy and provide process consistency.

Featured on the APR-5000-XLS Advanced Package Rework System is an innovative Split Vision System, which allows operators to view the opposite corners of a component, including splitting on rectangular components, with the necessary magnification to make its placement and registration fast and accurate.