automated inspection machine / for wafers / surface / defect
EB30™

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automated inspection machine automated inspection machine - EB30™
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Characteristics

  • Technology:

    automated

  • Applications:

    for wafers, surface

  • Other characteristics:

    defect

Description

Combining edge and backside inspection into one module

Product Overview

The Class 1 certified E30 and B30 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.

The EB30 module captures defect images on the fly, creates whole-wafer composite images, and is fully integrated for SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using our Discover Defect software analysis package. Correlating EBR metrology with all-surface defectivity data, SEM data and micro-inspection results is only the beginning of what Discover software can do. In addition to the advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software.

Applications

Edge Inspection
Lithography process monitoring
Cracks/Chips
Residue
EBR Concentricity
Bonding adhesive inspection


Backside Inspection

Scratches
Chuck/end effector signatures
Wafer level pattern detection
Backside defect to frontside defect correlation

Specifications

Detects blister defects
Detects slurry, cleaning contaminants and residual films
Automated Edge Bead Removal metrology (EBR)
Detects chips and cracks
Addresses contamination issues
Finds delamination defects
Backside particles and residues
Wafer level defect signatures
Detects scratches and defect clusters