lithography system for the semiconductor industry
for the semiconductor industry
The Onto Innovation JetStep X700 system is designed for processing panels to meet critical industry fan-out panel-level packaging requirements and extendible to sub-micron imaging processes.
The JetStep X700 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel level packaging, such as; die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling. It incorporates the largest available exposure field with resolution capability to 2µm and options for increased resolution to 1µm.