lithography system for the semiconductor industry
JetStep® X300

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lithography system for the semiconductor industry lithography system for the semiconductor industry - JetStep® X300


  • Type:

    for the semiconductor industry


The JetStep X300 is designed and engineered for the most challenging advanced packaging applications

Product Overview

As resolution, overlay and other critical lithography specifications become tighter and more sophisticated for advanced packaging processes, fulfilling lithography requirements becomes a challenge. Onto Innovation's JetStep X300 System has been specifically designed to meet advance packaging challenges with the largest field size in the industry and application-specific options including submicron projection lens, warped wafer handling, on-the-fly optical focus, wafer edge processing and backside alignment. Now, the system has a 30% smaller footprint and is 25% faster than the previous generation.


Fan-out wafer level packaging (FOWLP)
Wafer-level chip scale packaging (WLCSP)
Through silicon via (TSV)
Non-standard substrates


High-fidelity projection lens and illumination system delivers the largest process window for 2µm and 1µm resolutions
User-selectable wavelength settings
Automatic compensation of die shift for superior registration to zero layer
Backside alignment
6 inch square reticle format enables cost efficient reticle and lower COO
6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
Automated reticle handling and storage system with fast reticle exchange to maximize throughput
Fully programmable and flexible pattern recognition alignment system
Real time “on the fly” autofocus at every exposure site to automatically adjust focus over topology
Environmental management system to mitigate fab contamination