The Xi 400 with microscope optics is the most powerful infrared camera system for printed circuit board analysis and electrical component temperature measurement in the affordable 382 x 288 resolution range. It combines a long-wave infrared camera with a microscope stage for precise focus and German-designed infrared optics optimized for small target images and measurement. This powerful infrared camera package is available in most markets at a budget-friendly price.
Small devices and connections in the electronics industry are common, but most infrared camera systems are built with optics optimized for larger targets. Various specifications are used to describe infrared resolution, making product comparison more difficult. Terms such as Instantaneous Field of View (IFOV), milliradian (mrad), pixel size, detector pitch, and Measurement Field of View (MFOV) are used by different manufacturers to specify this important performance attribute. This variation is partly driven by application requirements, where some cases prioritize temperature increase detection while others require accurate temperature measurement for component specification validation.
To simplify the process of communicating infrared camera resolution, rely on the “IFOV” specification (used interchangeably with spot size or pixel size) to determine a camera’s ability to detect temperature change. Use MFOV to determine a camera’s ability to make an accurate temperature measurement within the IR camera’s accuracy specification.
Most manufacturers do not include the MFOV specification, so check with the supplier