Thermal furnace SST 518

solderingmuffleelectric

The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas. The 518 benefits include: Precise control of soldering process profile Consistent, highly reliable solder interface Accurate control of thermal cycles Ease of use and flexibility of operation Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Flux Free Solder Process Development Assembly of High Reliability Microelectronic Packages Hybrid Microelectronic Circuit Assembly Fiber Optic Package Assembly Ceramic Package Sealing