thermal interface material
EYG-T series

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thermal interface material thermal interface material - EYG-T series


Introducing The New EYG-T Series “Graphite-PAD” Thermal Interface Material From PanasonicHigh Thermal Conductivity In The Z-Direction With Superior FlexibilityPanasonic, a worldwide leader in Thermal Management Products, is pleased to introduce NEW EYG-T Series “Graphite-PAD”. This new addition to Panasonic’s line of Thermal Management solutions is a thermal interface material that compatibly obtains excellent thermal conductivity in Z-axis thickness direction along with providing superior flexibility. The new Graphite-PAD product provides properties that are greater than that of most existing thermal interface materials.Graphite-PADs are composed of silicone resin and Pyrolytic Graphite Sheets (PGS) as filler. This combination of materials offers high Thermal Management reliability by enabling designs with high heat dissipation. The PGS inside the resin is oriented in a vertical direction. This oriented structure provides excellent thermal conductivity in thickness direction. The component is very flexible (deformable) since it is mainly composed of silicone resin. Being deformable with a low load facilitates installation.

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