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Epoxy die bonder MDP-200

epoxy die bonder
epoxy die bonder
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Description

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput. The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available. Features & Benefits Wafer mapping software capability Low bond force option Epoxy writing or pin transfer High accuracy Flexible for multiple die

Catalogs

MD-P200
MD-P200
2 Pages
MD-P200
MD-P200
2 Pages
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.