Molybdenum alloy wire

Molybdenum alloy wire - Plansee SE
Molybdenum alloy wire - Plansee SE
Molybdenum alloy wire - Plansee SE - image - 2
Molybdenum alloy wire - Plansee SE - image - 3
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Characteristics

Shape
wire

Description

Description
Fine wires made of molybdenum (Mo) and tungsten (W) for technical applications where specific refractory-metal properties are required. Standard stock diameters are available and custom diameters and surface finishes can be produced for volume orders and specialized uses.

Key product features
  • Very fine wires down to 10 µm for precision applications
  • Standard dimensions available from stock and custom sizes on request
  • High surface quality and tight diameter tolerances
  • Special doping and alloy variants to match application requirements
  • Comprehensive final inspections and quality control procedures
  • Large production capacity and flexible manufacturing processes


Typical applications
  • Filaments and support/core wires for halogen, fluorescent and incandescent lamps
  • Fine medical wire for devices and sensors
  • Window and windshield heating elements (automotive)
  • Coating systems, vacuum deposition targets and evaporation boats
  • Satellite and aerospace components requiring refractory-metal parts


Materials and special grades
  • Mo — molybdenum: creep-resistant, high stiffness, low thermal expansion, high thermal conductivity
  • ML — molybdenum stabilized with ~0.3 wt% lanthanum oxide: increased creep resistance and higher recrystallization temperature
  • Mo-ILQ — micro-doped molybdenum (~0.03 wt% La2O3): improved formability compared with ML
  • W — tungsten: highest melting point among metals, creep-resistant, good electrical conductivity
  • WVM — potassium-doped tungsten with stacked microstructure: improved dimensional stability at high temperature
  • WRe05, WRe26 — tungsten-rhenium alloys: increased ductility, lower ductile-brittle transition temperature, improved creep properties


Technologies and processes
  • Integrated production chain: powder production → pressing → sintering → hot working → wire drawing → finishing
  • Automatic powder handling and process control to ensure material purity
  • Hot working and process optimization specifically for wire manufacture
  • Surface treatments: graphitizing, pickling, electropolishing
  • Computer-controlled process management and eddy-current testing during production
  • Comprehensive final inspections to verify specified properties
  • Recycling and supply-chain integration for Mo and W powders


Downloads (product specifications)
  • Mo wire specification
  • Mo-ILQ wire specification
  • ML wire specification
  • WL05 / W / WVM / WRe product specification sets


Technical features / specifications
  • Material — Diameter ranges (mm):
  • Mo: 0.015 - 3.17
  • ML: 0.200 - 3.17
  • Mo-ILQ: 0.015 - 3.17
  • W: 0.025 - 1.50
  • WL05: 0.010 - 1.50 (fine wires down to 10 µm)
  • WVM: 0.050 - 1.50
  • WRe05, WRe26: 0.400 - 1.50
  • Product finishes: graphitized, pickled, electropolished
  • Typical QA: strict diameter tolerances, eddy-current testing, final inspections

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.