Chamfering machine grinding polishing machine GC-GP750

chamfering machine grinding polishing machine
chamfering machine grinding polishing machine
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Characteristics

Other characteristics
chamfering machine

Description

GC-GP750 is an all-in-one machine for chamfering, grinding and polishing of different sizes of mono-silicon materials after squaring. It also has rough grinding, fine grinding, and chamfering function. Equipment characteristics: Low cost High production capacity Easy operation Compact structure and small floor space Advantages: •Maximum speed of 45m/s, with high grinding efficiency •Improve fast-speed blade matching, and repair empty travel •Provided with cooling water pump booster to improve flow water rate and pressure and therefore increase grinding radiation efficiency. •Provided with auto blade self-repair function to improve the precision of workpiece and cleanness.

Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2024
Intersolar 2024

18-21 Jun 2024 Munich (Germany) Hall Vide - Stand A2.415

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.