Monocrystalline silicon cutting machine Mono802S
diamond wirebladefor industrial applications

monocrystalline silicon cutting machine
monocrystalline silicon cutting machine
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Characteristics

Technology
blade, diamond wire
Material
for monocrystalline silicon
Applications
for industrial applications
Other characteristics
high-precision, high-efficiency
Tube diameter

Max.: 300 mm
(12 in)

Min.: 200 mm
(8 in)

Cutting speed

Max.: 30 m/s
(98.425 ft/s)

Min.: 0 m/s
(0 ft/s)

Overall length

5,200 mm
(205 in)

Overall width

3,800 mm
(150 in)

Height

2,400 mm
(94 in)

Weight

8,000 kg
(17,636.98 lb)

Description

This equipment is used for machining Mono-silicon bars. Cropping and sampling the hard and brittle materials through electroplated diamond wire with feeding process. It is a reliable, high-efficient and high precision equipment. Equipment characteristics: •Bar Length: 6500mm (Max.) •1 blade per time •Cutting duration: 8 minutes Equipment advantage: •Low cutting loss •High efficiency •Reliable performance

Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2024
Intersolar 2024

18-21 Jun 2024 Munich (Germany) Hall Vide - Stand A2.415

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.