Diamond wire cutting machine Mono809
for monocrystalline siliconfor industrial applicationshigh-speed

diamond wire cutting machine
diamond wire cutting machine
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Characteristics

Technology
diamond wire
Material
for monocrystalline silicon
Applications
for industrial applications
Other characteristics
high-speed, high-efficiency
Tube diameter

Max.: 270 mm
(11 in)

Min.: 150 mm
(6 in)

Cutting speed

Max.: 25 m/s
(82.021 ft/s)

Min.: 0 m/s
(0 ft/s)

Overall length

5,270 mm
(207 in)

Overall width

864 mm
(34 in)

Height

775 mm
(31 in)

Weight

12,000 kg
(26,455.47 lb)

Description

Equipment Introduction The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy. Equipment Feature: •Cutting stick length up to 4500mm •Everything can be cut 7 knife edge •30 minutes to complete a cutting Euipment Advantage: •Low cutting loss •High efficiency •Reliable function

Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2024
Intersolar 2024

18-21 Jun 2024 Munich (Germany) Hall Vide - Stand A2.415

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.