Modular design, strong extensibility of equipment.
Max PCBA dimension 610x610mm
Independent software, easy operation, easy understand.
Multiple programming methods including GERBER, JPG, file and CAD etc.
Unique visual graphical programming, more convenient.
Flux Jetting Module
●Single jetting, or dual jetting(optional).
●Imported high precision jetting valve, nozzle diameter 0.178 mm.
●Flux jetting X/Y position precision ≤±0.05mm.
●Atomized spraying and drip jetting both available for flux jetting.
●Flux level monitoring.
●Top hot air and bottom infrared preheating.
●For top and bottom preheating, the heating tubes at different area can be opened according to the size of PCBA, different area preheating and temperature controlling.
●Preheating temperature range: 0-200℃, control accuracy: ±2℃.
●Top hot air preheating optional for soldering module, ensure the temperature in soldering process, improve soldering quality.
Max wave peak height: 5 mm
Max soldering temperature: 350 °C
Auto detection of solder level, alarm when solder level drops to setting value.
Nozzle connected to base via the magnetic system. Nozzle can be fast replaced.
With lighting and camera system, the soldering process can be visual monitored.
Adjustable distance of dual pots 79-169mm(for optional).