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Removal system EA-F16FY
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Description
1. Large-diameter solder removal nozzle and high efficiency solder removal design.
2. Customized multiple specifications of solder removal nozzles.
3. Fully simulating the SMT reflow soldering heating temperature at the top and bottom and programmable in adjustment.
4. Precise motion of multi-axis robot motion platform and the moving position programmable.
5. QUICK cycle heating temperature control system, real-time monitoring of heating temperature, safe and efficient.
6. Applicable to: BGA solder removal and P C B solder pad removal.
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