Dry cleaning system

automaticfor wafers

The PCS - wet to dry post-polish cleaning system removes particles, contamination and creates perfectly clean wafer surfaces. The tool handles wafers up to 300 mm diameter. Whether full or half-pitch setup, carrier or carrierless handling - the machine adapts to your requirements and integrates perfectly into your fab. Features and benefits Wet input cart integration Outstanding surface cleanliness Carrierless handling Half-pitch process optional Advanced Process monitoring Multi-wafer transport to OHT loadport